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 19-2842; Rev 0; 4/03
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
General Description
The MAX4409 stereo headphone amplifier combines Maxim's DirectDrive architecture and a common-mode sense input, which allows the amplifier to reject common-mode noise. Conventional headphone amplifiers require a bulky DC-blocking capacitor between the headphone and the amplifier. DirectDrive produces a ground-referenced output from a single supply, eliminating the need for large DC-blocking capacitors, which saves cost, board space, and component height. The common-mode voltage sensing corrects for any difference between SGND of the amplifier and the headphone return. This feature minimizes ground-loop noise when the HP socket is used as a line out connection to other grounded equipment, for example, a PC connected to a home hi-fi system. The MAX4409 draws only 5mA of supply current, delivers up to 80mW per channel into a 16 load, and has a low 0.002% THD+N. A high 86dB power-supply rejection ratio allows this device to operate from noisy digital supplies without additional power-supply conditioning. The MAX4409 includes 8kV ESD protection on the headphone outputs. Comprehensive click-and-pop circuitry eliminates audible clicks and pops on startup and shutdown. A low-power shutdown mode reduces supply current draw to only 6A. The MAX4409 operates from a single 1.8V to 3.6V supply, has short-circuit and thermal overload protection, and is specified over the extended -40C to +85C temperature range. The MAX4409 is available in tiny 20-pin thin QFN and 14-pin TSSOP packages.
Features
o No Bulky DC-Blocking Capacitors Required o Ground-Referenced Outputs Eliminate DC-Bias Voltages on Headphone Ground Pin o Common-Mode Voltage Sensing Eliminates Ground-Loop Noise o 96dB CMRR o No Degradation of Low-Frequency Response Due to Output Capacitors o 80mW per Channel into 16 o Low 0.002% THD+N o High 86dB PSRR o Integrated Click-and-Pop Suppression o 1.8V to 3.6V Single-Supply Operation o Low Quiescent Current o Low-Power Shutdown Mode o Short-Circuit and Thermal-Overload Protection o 8kV ESD-Protected Amplifier Outputs o Available in Space-Saving Packages 14-Pin TSSOP 20-Pin Thin QFN
MAX4409
Ordering Information
PART MAX4409ETP MAX4409EUD TEMP RANGE -40C to +85C -40C to +85C PIN-PACKAGE 20 Thin QFN-EP* 14 TSSOP
*EP = Exposed paddle.
Applications
Notebooks Desktop PCs Cellular Phones PDAs MP3 Players Tablet PCs Portable Audio Equipment
SHDN LEFT AUDIO INPUT
Functional Diagram
MAX4409
DirectDrive OUTPUTS ELIMINATE DC-BLOCKING CAPACITORS
COM
RIGHT AUDIO INPUT
COMMON-MODE SENSE INPUT ELIMINATES GROUND-LOOP NOISE
Pin Configurations and Typical Application Circuit appear at end of data sheet. ________________________________________________________________ Maxim Integrated Products 1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
ABSOLUTE MAXIMUM RATINGS
PGND to SGND .....................................................-0.3V to +0.3V PVDD to SVDD .................................................................-0.3V to +0.3V PVSS to SVSS .........................................................-0.3V to +0.3V PVDD and SVDD to PGND or SGND .........................-0.3V to +4V PVSS and SVSS to PGND or SGND ..........................-4V to +0.3V IN_ and COM to SGND.................................SVSS to (SVDD - 1V) IN_ to COM .....................................(COM + 2V) to (COM - 0.3V) SHDN_ to SGND........................(SGND - 0.3V) to (SVDD + 0.3V) OUT_ to SGND ............................(SVSS - 0.3V) to (SVDD + 0.3V) C1P to PGND.............................(PGND - 0.3V) to (PVDD + 0.3V) C1N to PGND .............................(PVSS - 0.3V) to (PGND + 0.3V) Output Short Circuit to GND or VDD ...........................Continuous Continuous Power Dissipation (TA = +70C) 14-Pin TSSOP (derate 9.1mW/C above +70C) ..........727mW 20-Pin Thin QFN (derate 16.9mW/C above +70C) ..1349mW Junction Temperature ......................................................+150C Operating Temperature Range ...........................-40C to +85C Storage Temperature Range .............................-65C to +150C Lead Temperature (soldering, 10s) .................................+300C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(PVDD = SVDD = 3V, PGND = SGND = 0V, SHDN = SVDD, C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, RL = , TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Supply Voltage Range Quiescent Supply Current Shutdown Supply Current SYMBOL VDD IDD I SHDN SHDN = GND VIH SHDN Thresholds VIL SHDN Input Leakage Current SHDN to Full Operation CHARGE PUMP Oscillator Frequency AMPLIFIERS Input Offset Voltage Input Bias Current COM Bias Current Equivalent Input Offset Current COM Input Range Common-Mode Rejection Ratio Power-Supply Rejection Ratio VOS IBIAS ICOM IOS VCOM CMRR PSRR IOS = (IBIAS(INR) + IBIAS(INL) - ICOM) / 2 Inferred from CMRR test -500mV VCOM +500mV, RSOURCE 10 1.8V VDD 3.6V VDD = 3.0V, 200mVP-P ripple THD+N = 1%, TA = +25C DC (Note 2) fRIPPLE = 1kHz fRIPPLE = 20kHz RL = 32 RL = 16 55 -500 75 75 96 86 76 48 65 80 mW dB RL = 32 -700 -1400 0.5 -100 -200 2 +500 2.4 0 0 mV nA nA nA mV dB fOSC 272 320 368 kHz tSON -1 175 0.7 x SVDD 0.3 x SVDD +1 A s CONDITIONS Guaranteed by PSRR test MIN 1.8 5 6 TYP MAX 3.6 8.4 10 UNITS V mA A
V
Output Power
POUT
2
_______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
ELECTRICAL CHARACTERISTICS (continued)
(PVDD = SVDD = 3V, PGND = SGND = 0V, SHDN = SVDD, C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, RL = , TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25C.) (Note 1)
PARAMETER Total Harmonic Distortion Plus Noise Signal-to-Noise Ratio Slew Rate Maximum Capacitive Load Crosstalk Thermal Shutdown Threshold Thermal Shutdown Hysteresis ESD Protection Human Body Model (OUTR, OUTL) SYMBOL CONDITIONS RL = 32, POUT = 50mW RL = 16, POUT = 60mW MIN TYP 0.002 % 0.005 95 0.8 No sustained oscillations RL = 16, POUT = 1.6mW, fIN = 10kHz 150 55 140 15 8 dB V/s pF dB C C kV MAX UNITS
MAX4409
THD+N
fIN = 1kHz
SNR SR CL
RL = 32, POUT = 20mW, fIN = 1kHz
Note 1: All specifications are 100% tested at TA = +25C; temperature limits are guaranteed by design. Note 2: Inputs are connected to ground and COM. Note 3: Inputs are AC-coupled to ground. COM is connected to ground.
Typical Operating Characteristics
(C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, THD+N measurement bandwidth = 22Hz to 22kHz, TA = +25C, unless otherwise noted.)
TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY
MAX4409 toc01
TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY
VDD = 3V RL = 32
MAX4409 toc02
TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY
VDD = 1.8V RL = 16
MAX4409 toc03
1 VDD = 3V RL = 16
1
1
0.1 THD+N (%) POUT = 60mW POUT = 10mW THD+N (%)
0.1 THD+N (%)
0.1 POUT = 15mW POUT = 5mW
0.01
0.01
POUT = 50mW POUT = 10mW
0.01
0.001 10 100 1k FREQUENCY (Hz) 10k 100k
0.001 10 100 1k FREQUENCY (Hz) 10k 100k
0.001 10 100 1k FREQUENCY (Hz) 10k 100k
_______________________________________________________________________________________
3
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Typical Operating Characteristics (continued)
(C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, THD+N measurement bandwidth = 22Hz to 22kHz, TA = +25C, unless otherwise noted.)
TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCY
MAX4409 toc04
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc05
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
VDD = 3V f = 1kHz RL = 16
MAX4409 toc06
1 VDD = 1.8V RL = 32
100 VDD = 3V f = 20Hz RL = 16
100
10
10
0.1 THD+N (%) THD+N (%) 1
THD+N (%)
OUTPUTS IN PHASE
1
OUTPUTS IN PHASE
POUT = 15mW 0.01 POUT = 5mW
0.1
0.1
0.01 0.001 10 100 1k FREQUENCY (Hz) 10k 100k 0.001 0 30 60 90 120
OUTPUTS OUT OF PHASE 150 180
0.01 0.001 0 30 60 90 120
OUTPUTS OUT OF PHASE 150 180
OUTPUT POWER (W)
OUTPUT POWER (W)
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc07
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc08
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
VDD = 3V f = 1kHz RL = 32
MAX4409 toc09
100 VDD = 3V f = 10kHz RL = 16 OUTPUTS IN PHASE
100 10 1 THD+N (%) 0.1 0.01 OUTPUTS IN PHASE OUTPUTS OUT OF PHASE VDD = 3V f = 20Hz RL = 32
100
10
10
THD+N (%)
THD+N (%)
1
1 OUTPUTS IN PHASE 0.1
0.1 OUTPUTS OUT OF PHASE 0 30 60 90 120 150 180
0.01 0.001 OUTPUT POWER (W)
0.001 0.0001 0 20 40 60 80
0.01 0.001
OUTPUTS OUT OF PHASE 0 20 40 60 80 100 120
100
120
OUTPUT POWER (W)
OUTPUT POWER (W)
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
VDD = 3V f = 10kHz RL = 32 OUTPUTS IN PHASE
MAX4409 toc10
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc11
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
VDD = 1.8V f = 1kHz RL = 16
MAX4409 toc12
100
100 VDD = 1.8V f = 20Hz RL = 16 OUTPUTS IN PHASE
100
10
10
10
THD+N (%)
THD+N (%)
1
THD+N (%)
1
1
OUTPUTS IN PHASE
0.1
0.01 0.001 0 20
OUTPUTS OUT OF PHASE
0.1 OUTPUTS OUT OF PHASE
0.1 OUTPUTS OUT OF PHASE 0 10 20 30 40 50 60
0.01 0.001
0.01 0.001
60 80 OUTPUT POWER (W)
40
100
120
0
10
20
30
40
50
60
OUTPUT POWER (W)
OUTPUT POWER (W)
4
_______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
Typical Operating Characteristics (continued)
(C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, THD+N measurement bandwidth = 22Hz to 22kHz, TA = +25C, unless otherwise noted.)
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc13
MAX4409
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc14
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
VDD = 1.8V f = 1kHz RL = 32
MAX4409 toc15
100 VDD = 1.8V f = 10kHz RL = 16
100 VDD = 1.8V f = 20Hz RL = 32
100
10
10
10
THD+N (%)
OUTPUTS IN PHASE 0.1
OUTPUTS IN PHASE
THD+N (%)
1
THD+N (%)
1
1 OUTPUTS IN PHASE OUTPUTS OUT OF PHASE 0 10 20 OUTPUT POWER (W) 30 40
0.1
0.1
0.01 0.001 0 10 20 30 40
OUTPUTS OUT OF PHASE 50 60
0.01 0.001 0 10 20 OUTPUT POWER (W)
OUTPUTS OUT OF PHASE 30 40
0.01 0.001
OUTPUT POWER (W)
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
MAX4409 toc16
POWER-SUPPLY REJECTION RATIO vs. FREQUENCY
MAX4409 toc17
POWER-SUPPLY REJECTION RATIO vs. FREQUENCY
-10 -20 -30 PSRR (dB) -40 -50 -60 -70 -80 -90 VDD = 3V VIN = 200mVP-P RL = 16
MAX4410 toc18
100 VDD = 1.8V f = 10kHz RL = 32
0 -10 -20 -30 VDD = 3V VIN = 200mVP-P RL = 16
0
10
THD+N (%)
PSRR (dB) OUTPUTS OUT OF PHASE 20 30 40
1 OUTPUTS IN PHASE
-40 -50 -60
0.1
0.01 0.001 0 10 OUTPUT POWER (W)
-70 -80 -90 10 100 1k FREQUENCY (Hz) 10k 100k
10
100
1k FREQUENCY (Hz)
10k
100k
POWER-SUPPLY REJECTION RATIO vs. FREQUENCY
MAX4410 toc19
POWER-SUPPLY REJECTION RATIO vs. FREQUENCY
MAX4410 toc20
CROSSTALK vs. FREQUENCY
-10 -20 CROSSTALK (dB) -30 -40 -50 -60 -70 -80 -90 LEFT TO RIGHT RIGHT TO LEFT VIN = 200mVP-P
MAX4410 toc21
0 -10 -20 -30 PSRR (dB) VDD = 1.8V VIN = 200mVP-P RL = 16
0 -10 -20 -30 PSRR (dB) -40 -50 -60 -70 -80 -90 VDD = 1.8V VIN = 200mVP-P RL = 32
0
-40 -50 -60 -70 -80 -90 10 100 1k FREQUENCY (Hz) 10k 100k
10
100
1k FREQUENCY (Hz)
10k
100k
10
100
1k FREQUENCY (Hz)
10k
100k
_______________________________________________________________________________________
5
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Typical Operating Characteristics (continued)
(C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, THD+N measurement bandwidth = 22Hz to 22kHz, TA = +25C, unless otherwise noted.)
COMMON-MODE REJECTION RATIO vs. FREQUENCY
-10 -20 -30 CMRR (dB) -40 -50 -60 -70 -80 -90 -100 10 100 1k FREQUENCY (Hz) 10k 100k VIN = 500mVP-P
MAX4409 toc22
OUTPUT POWER vs. SUPPLY VOLTAGE
MAX4409 toc23
OUTPUT POWER vs. SUPPLY VOLTAGE
fIN = 1kHz RL = 16 THD+N = 10% INPUTS 180 OUT OF PHASE
MAX4409 toc24
0
200 180 160 OUTPUT POWER (mW) 140 120 100 80 60 40 20 0 1.8 2.1 2.4 2.7 3.0 3.3 INPUTS IN PHASE fIN = 1kHz RL = 16 THD+N = 1% INPUTS 180 OUT OF PHASE
300 250 OUTPUT POWER (mW) 200 150 100 50 0 INPUTS IN PHASE
3.6
1.8
2.1
2.4
2.7
3.0
3.3
3.6
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
OUTPUT POWER vs. SUPPLY VOLTAGE
MAX4409 toc25
OUTPUT POWER vs. SUPPLY VOLTAGE
MAX4409 toc26
OUTPUT POWER vs. LOAD RESISTANCE
140 OUTPUT POWER (mW) 120 100 80 60 40 20 0 INPUTS IN PHASE 10 100 1k 10k 100k INPUTS 180 OUT OF PHASE VDD = 3V fIN = 1kHz THD+N = 1%
MAX4409 toc27
140 120 OUTPUT POWER (mW) 100 80 60 40 20 0 1.8 2.1 2.4 2.7 3.0 3.3 INPUTS IN PHASE fIN = 1kHz RL = 32 THD+N = 1% INPUTS 180 OUT OF PHASE
180 160 140 OUTPUT POWER (mW) 120 100 80 60 40 20 0 INPUTS IN PHASE fIN = 1kHz RL = 32 THD+N = 10% INPUTS 180 OUT OF PHASE
160
3.6
1.8
2.1
2.4
2.7
3.0
3.3
3.6
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
LOAD RESISTANCE ()
OUTPUT POWER vs. LOAD RESISTANCE
MAX4409 toc28
OUTPUT POWER vs. LOAD RESISTANCE
MAX4409 toc29
OUTPUT POWER vs. LOAD RESISTANCE
VDD = 1.8V fIN = 1kHz THD+N = 10%
MAX4409 toc30
250 VDD = 3V fIN = 1kHz THD+N = 10%
45 40 35 OUTPUT POWER (mW) 30 25 20 15 10 INPUTS IN PHASE INPUTS 180 OUT OF PHASE VDD = 1.8V fIN = 1kHz THD+N = 1%
70 60 OUTPUT POWER (mW) 50 40 30 20 10 0 INPUTS IN PHASE INPUTS 180 OUT OF PHASE
200 OUTPUT POWER (mW)
150 INPUTS 180 OUT OF PHASE
100
50 INPUTS IN PHASE 0 10 100 1k 10k 100k LOAD RESISTANCE ()
5 0 10 100 1k 10k 100k LOAD RESISTANCE ()
10
100
1k
10k
100k
LOAD RESISTANCE ()
6
_______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
Typical Operating Characteristics (continued)
(C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, THD+N measurement bandwidth = 22Hz to 22kHz, TA = +25C, unless otherwise noted.)
POWER DISSIPATION vs. OUTPUT POWER
MAX4409 toc31
MAX4409
POWER DISSIPATION vs. OUTPUT POWER
MAX4409 toc32
POWER DISSIPATION vs. OUTPUT POWER
fIN = 1kHz RL = 16 VDD = 1.8V POUT = POUTL + POUTR INPUTS IN PHASE
MAX4409 toc33
400 350 POWER DISSIPATION (mW) 300 250 200 150 100 50 0 0 40 80 120 fIN = 1kHz RL = 16 VDD = 3V POUT = POUTL + POUTR
INPUTS IN PHASE
180 160 POWER DISSIPATION (mW) 140 120 100 80 60 40 20 0
INPUTS IN PHASE
140 120 POWER DISSIPATION (mW) 100 80 60 40 20 0
INPUTS 180 OUT OF PHASE
INPUTS 180 OUT OF PHASE
INPUTS 180 OUT OF PHASE
fIN = 1kHz RL = 32 VDD = 3V POUT = POUTL + POUTR 0 40 80 120 160 200
160
200
0
10
20
30
40
50
60
OUTPUT POWER (mW)
OUTPUT POWER (mW)
OUTPUT POWER (mW)
POWER DISSIPATION vs. OUTPUT POWER
MAX4409 toc34
GAIN AND PHASE vs. FREQUENCY
80 60 40 20 0 -20 -40 -60 -80 -100 -120 -140 -160 -180 100
MAX4409 toc35
GAIN FLATNESS vs. FREQUENCY
MAX4410 toc36
70 60 POWER DISSIPATION (mW) 50 40 30 20 10 0 0 10 20 30 40 50 fIN = 1kHz RL = 32 VDD = 1.8V POUT = POUTL + POUTR INPUTS 180 OUT OF PHASE INPUTS IN PHASE
10 0 -10 GAIN (dB) -20 -30
GAIN
GAIN/PHASE (dB/DEGREES)
PHASE
VDD = 3V AV = 1000V/V RL = 16 1k 10k 100k 1M 10M
-40 -50 10
VDD = 3V AV = -1V/V RL = 16 100 1k 10k 100k 1M 10M
60
OUTPUT POWER (mW)
FREQUENCY (Hz)
FREQUENCY (Hz)
CHARGE-PUMP OUTPUT RESISTANCE vs. SUPPLY VOLTAGE
MAX4409 toc37
OUTPUT POWER vs. CHARGE-PUMP CAPACITANCE AND LOAD RESISTANCE
MAX4409 toc38
OUTPUT SPECTRUM vs. FREQUENCY
VIN = 1VP-P fIN = 1kHz RL = 32 AV = -1V/V
MAX4409 toc39
10 VIN_ = GND IPVSS = 10mA NO LOAD
90 C1 = C2 = 2.2F 80 C1 = C2 = 1F 70 OUTPUT POWER (mW) 60 50 40 30 20 10 C1 = C2 = 0.47F fIN = 1kHz THD+N = 1% INPUTS IN PHASE 10 20 30 40 C1 = C2 = 0.68F
0 -20 OUTPUT SPECTRUM (dB) -40 -60 -80 -100 -120 100 1k 10k
OUTPUT RESISTANCE ()
8
6
4
2
0 1.8 2.1 2.4 2.7 3.0 3.3 3.6 SUPPLY VOLTAGE (V)
0 50 LOAD RESISTANCE ()
100k
FREQUENCY (Hz)
_______________________________________________________________________________________
7
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Typical Operating Characteristics (continued)
(C1 = C2 = 2.2F, RIN = RF = R1 = R2 = 10k, THD+N measurement bandwidth = 22Hz to 22kHz, TA = +25C, unless otherwise noted.)
SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX4409 toc40
SHUTDOWN SUPPLY CURRENT vs. SUPPLY VOLTAGE
MAX4409 toc41
POWER-UP/DOWN WAVEFORM
MAX4409 toc42
10
10 SHDN = GND 8 SUPPLY CURRENT (A)
3V VDD 0V
8 SUPPLY CURRENT (mA)
6
6 OUT_ 4 -100dB 10mV/div
4
2
2
OUT_FFT
20dB/div
0 0 0.9 1.8 2.7 3.6 SUPPLY VOLTAGE (V)
0 0 0.9 1.8 2.7 3.6 RL = 32 VIN_ = GND SUPPLY VOLTAGE (V) 200ms/div FFT: 25Hz/div
Pin Description
PIN TSSOP 1 2 3 4 5 6 7 8 9 10 11 12 13 14 -- -- THIN QFN 18 19 1 2 3 5 7 9 10 13 11 14 15 17 4, 6, 8, 12, 16, 20 -- NAME COM PVDD C1P PGND C1N PVSS SVSS OUTL SVDD INL OUTR SHDN INR SGND N.C. EP Common-Mode Voltage Sense Input Charge-Pump Power Supply. Powers charge-pump inverter, charge-pump logic, and oscillator. Flying Capacitor Positive Terminal Power Ground. Connect to SGND. Flying Capacitor Negative Terminal Charge-Pump Output Amplifier Negative Power Supply. Connect to PVSS. Left-Channel Output Amplifier Positive Power Supply. Connect to PVDD. Left-Channel Audio Input Right-Channel Output Active-Low Shutdown. Connect to VDD for normal operation. Right-Channel Audio Input Signal Ground. Connect to PGND. No Connection. Not internally connected. Exposed Paddle. Leave this connection floating. Do not connect to VDD or GND. FUNCTION
8
_______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
Detailed Description
The MAX4409 stereo headphone driver features Maxim's patented DirectDrive architecture, eliminating the large output-coupling capacitors required by traditional singlesupply headphone drivers. The device consists of two 80mW Class AB headphone drivers, undervoltage lockout (UVLO)/shutdown control, charge-pump, and comprehensive click-and-pop suppression circuitry (see Typical Application Circuit). The charge pump inverts the positive supply (PV DD ), creating a negative supply (PVSS). The headphone drivers operate from these bipolar supplies with their outputs biased about GND (Figure 1). The drivers have almost twice the supply range compared to other 3V single-supply drivers, increasing the available output power. The benefit of this GND bias is that the driver outputs do not have a DC component typically VDD/2. Thus, the large DC-blocking capacitors are unnecessary, improving frequency response while conserving board space and system cost. The MAX4409 also features a common-mode voltage sense input that corrects for mismatch between the SGND of the device and the potential at the headphone jack return. A low-power shutdown mode reduces supply current to 6A. The device features an undervoltage lockout that prevents operation from an insufficient power supply and click-and-pop suppression that eliminates audible transients on startup and shutdown. Additionally, the MAX4409 features thermal overload and short-circuit protection and can withstand 8kV ESD strikes on the output pins.
MAX4409
VDD VOUT VDD/2 GND
CONVENTIONAL DRIVER-BIASING SCHEME
+VDD
VOUT
GND
-VDD
DirectDrive BIASING SCHEME
Figure 1. Traditional Driver Output Waveform vs. MAX4409 Output Waveform
Common-Mode Sense
When the headphone jack is used as a line out to interface between other equipment (notebooks, desktops, and stereo receivers), potential differences between the equipment grounds can create ground loops and excessive ground current flow. The MAX4409 COM input senses and corrects for the difference between the headphone return and device ground. Connect COM through a resistive voltage-divider between the headphone jack return and SGND of the device (see Typical Application Circuit). For optimum commonmode rejection, use the same value resistors for R1 and RIN, and R2 and RF. Improve DC CMRR by adding a capacitor in between with SGND and R2 (see Typical Application Circuit). If ground sensing is not required, connect COM directly to SGND through a 5k resistor. from the headphone. Without these capacitors, a significant amount of DC current flows to the headphone, resulting in unnecessary power dissipation and possible damage to both headphone and headphone driver. Maxim's patented DirectDrive architecture uses a charge pump to create an internal negative supply voltage. This allows the outputs of the MAX4409 to be biased about GND, almost doubling dynamic range while operating from a single supply. With no DC component, there is no need for the large DC-blocking capacitors. Instead of two large (220F, typ) tantalum capacitors, the MAX4409 charge pump requires two small ceramic capacitors, thereby conserving board space, reducing cost, and improving the frequency response of the headphone driver. See the Output Power vs. Charge-Pump Capacitance and Load Resistance graph in the Typical Operating Characteristics for details of the possible capacitor sizes. There is a low DC voltage on the driver outputs due to amplifier offset. However, the offset of the MAX4409 is
9
DirectDrive
Traditional single-supply headphone drivers have their outputs biased about a nominal DC voltage (typically half the supply) for maximum dynamic range. Large coupling capacitors are needed to block this DC bias
_______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
typically 0.5mV, which, when combined with a 32 load, results in less than 16A of DC current flow to the headphones. Previous attempts to eliminate the output-coupling capacitors involved biasing the headphone return (sleeve) to the DC-bias voltage of the headphone amplifiers. This method raises some issues: * When combining a microphone and headphone on a single connector, the microphone bias scheme typically requires a 0V reference. * The sleeve is typically grounded to the chassis. Using this biasing approach, the sleeve must be isolated from system ground, complicating product design. * During an ESD strike, the driver's ESD structures are the only path to system ground. Thus, the driver must be able to withstand the full ESD strike. When using the headphone jack as a line out to other equipment, the bias voltage on the sleeve may conflict with the ground potential from other equipment, resulting in possible damage to the drivers. * The voltage coefficient of the DC-blocking capacitor contributes distortion to the reproduced audio signal as the capacitance value varies as a function of the voltage change across the capacitor. At low frequencies, the reactance of the capacitor dominates at frequencies below the -3dB point and the voltage coefficient appears as frequency-dependent distortion. Figure 3 shows the THD+N introduced by two different capacitor dielectric types. Note that below 100Hz, THD+N increases rapidly. The combination of low-frequency attenuation and frequency-dependent distortion compromises audio reproduction in portable audio equipment that emphasizes low-frequency effects such as multimedia lapLF ROLL OFF (16 LOAD)
-3 -5 ATTENUATION (dB) -10 100F -15 33F -20 -25 -30 -35 10 100 FREQUENCY (Hz) 1k 330F 220F -3dB CORNER FOR 100F IS 100Hz
MAX4409 fig02
0
*
Low-Frequency Response In addition to the cost and size disadvantages of the DCblocking capacitors required by conventional headphone amplifiers, these capacitors limit the amplifier's low-frequency response and can distort the audio signal: * The impedance of the headphone load and the DCblocking capacitor form a highpass filter with the -3dB point set by: f-3dB = 1 2RLCOUT
Figure 2. Low-Frequency Attenuation for Common DC-Blocking Capacitor Values
ADDITIONAL THD+N DUE TO DC-BLOCKING CAPACITORS
MAX4409 fig03
where RL is the headphone impedance and COUT is the DC-blocking capacitor value. The highpass filter is required by conventional single-ended, single power-supply headphone drivers to block the midrail DC bias component of the audio signal from the headphones. The drawback to the filter is that it can attenuate low-frequency signals. Larger values of COUT reduce this effect but result in physically larger, more expensive capacitors. Figure 2 shows the relationship between the size of COUT and the resulting low-frequency attenuation. Note that the -3dB point for a 16 headphone with a 100F blocking capacitor is 100Hz, well within the normal audio band, resulting in low-frequency attenuation of the reproduced signal.
10
1
THD+N (%)
0.1 TANTALUM 0.01
0.001 ALUM/ELEC 0.0001 10 100 1k FREQUENCY (Hz) 10k 100k
Figure 3. Distortion Contributed by DC-Blocking Capacitors 10 ______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
tops, as well as MP3, CD, and DVD players. By eliminating the DC-blocking capacitors through DirectDrive technology, these capacitor-related deficiencies are eliminated. Charge Pump The MAX4409 features a low-noise charge pump. The 320kHz switching frequency is well beyond the audio range, and thus does not interfere with the audio signals. The switch drivers feature a controlled switching speed that minimizes noise generated by turn-on and turn-off transients. By limiting the switching speed of the switches, the di/dt noise caused by the parasitic bond wire and trace inductance is minimized. Although not typically required, additional high-frequency noise attenuation can be achieved by increasing the size of C2 (see Typical Application Circuit).
Applications Information
Power Dissipation
Under normal operating conditions, linear power amplifiers can dissipate a significant amount of power. The maximum power dissipation for each package is given in the Absolute Maximum Ratings section under Continuous Power Dissipation or can be calculated by the following equation: TJ(MAX) - TA PDISSPKG(MAX) = JA where TJ(MAX) is +150C, TA is the ambient temperature, and JA is the reciprocal of the derating factor in C/W as specified in the Absolute Maximum Ratings section. For example, JA of the TSSOP package is +109.9C/W. The MAX4409 has two sources of power dissipation, the charge pump and two drivers. If the power dissipation for a given application exceeds the maximum allowed for a given package, either reduce V DD , increase load impedance, decrease the ambient temperature, or add heat sinking to the device. Large output, supply, and ground traces improve the maximum power dissipation in the package. Thermal overload protection limits total power dissipation in the MAX4409. When the junction temperature exceeds +140C, the thermal-protection circuitry disables the amplifier output stage. The amplifiers are enabled once the junction temperature cools by 15C. This results in a pulsing output under continuous thermal-overload conditions. Output Power The device has been specified for the worst-case scenario--when both inputs are in phase. Under this condition, the drivers simultaneously draw current from the charge pump, leading to a slight loss in headroom of VSS. In typical stereo audio applications, the left and right signals have differences in both magnitude and phase, subsequently leading to an increase in the maximum attainable output power. Figure 4 shows the two extreme cases for in and out of phase. In reality, the available power lies between these extremes.
MAX4409
Shutdown
The MAX4409 features an active-low SHDN control. Driving SHDN low disables the charge pump and amplifiers, sets the amplifier output impedance to approximately 1k, and reduces supply current draw to less than 6A.
Click-and-Pop Suppression
In traditional single-supply audio drivers, the outputcoupling capacitor is a major contributor of audible clicks and pops. Upon startup, the driver charges the coupling capacitor to its bias voltage, typically half the supply. Likewise, on shutdown the capacitor is discharged to GND. This results in a DC shift across the capacitor, which in turn, appears as an audible transient at the speaker. Since the MAX4409 does not require output-coupling capacitors, this does not arise. Additionally, the MAX4409 features extensive click-andpop suppression that eliminates any audible transient sources internal to the device. The Power-Up/Down Waveform in the Typical Operating Characteristics shows that there are minimal spectral components in the audible range at the output upon startup or shutdown. In most applications, the output of the preamplifier driving the MAX4409 has a DC bias of typically half the supply. At startup, the input-coupling capacitor is charged to the preamplifier's DC-bias voltage through the RF of the MAX4409, resulting in a DC shift across the capacitor and an audible click/pop. Delaying the rise of the SHDN_ signals 4 to 5 time constants (40ms to 50ms) based on RIN and CIN relative to the start of the preamplifier eliminates this click/pop caused by the input filter.
Powering Other Circuits from a Negative Supply
An additional benefit of the MAX4409 is the internally generated, negative supply voltage (PVSS). This voltage is used by the MAX4409 to provide the ground-referenced output level. It can, however, also be used to power other devices within a design. Current draw from this negative supply (PVSS) should be limited to 5mA; exceeding this affects the operation of the headphone
11
______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
driver. The negative supply voltage appears on the PVSS pin. A typical application is a negative supply to adjust the contrast of LCD modules. When considering the use of PVSS in this manner, note that the charge-pump voltage at PVSS is roughly proportional to -VDD and is not a regulated voltage. The charge-pump output impedance plot appears in the Typical Operating Characteristics.
TOTAL HARMONIC DISTORTION PLUS NOISE vs. OUTPUT POWER
VDD = 3V AV = -1V/V RL = 16 fIN = 10kHz
MAX4409 fig04
100
10
Component Selection
Gain-Setting Resistors External feedback components set the gain of the MAX4409. Resistors RF and RIN (see Typical Application Circuit) set the gain of each amplifier as follows: R AV = - F RIN Choose feedback resistor values of 10k. Values other than 10k increase VOS due to the input bias current, which in turn increases the amount of DC current flow to the load. Resistors RIN, R2, RF, and R1 must be of equal value for best results. Use high-tolerance resistors for best matching and CMRR. For example, the worst-case CMRR attributed to a 1% resistor mismatch is -34dB. This is the worst case, and typical resistors do not affect CMRR as drastically. The effect of resistor mismatch is shown in Figure 5. If all resistors match exactly, then any voltage applied to node A should be duplicated on OUT so no net differential voltage appears between node A (normally the HP jack socket GND) and OUT. For resistors with a tolerance of n%, the worst mismatch is found when RIN and R1 are at +n%, and RF and R2 are at -n%. If all four resistors are nominally the same value, then 2n% of the voltage at A appears between A and OUT. Packaged resistor arrays can provide well-matched components for this type of application. Although their absolute tolerance is not well controlled, the internal matching of resistors can be very good. At higher frequencies, the rejection is usually limited by PC board layout; care should be taken to make sure any stray capacitance due to PC board traces on node N1 matches those on node N2. Ultimately, CMRR performance is limited by the amplifier itself (see Electrical Characteristics).
THD+N (%)
1 OUTPUTS IN PHASE OUTPUTS 180 OUT OF PHASE ONE CHANNEL
0.1
0.01 0.001 0 50 100 150 200 OUTPUT POWER (mW)
Figure 4. Output Power vs. THD+N with Inputs In/Out of Phase
RF
RIN
N1 OUT
MAX4409
R2
N2
R1 A
Figure 5. Common-Mode Sense Equivalent Circuit
additional capacitor. Input Filtering The input capacitor (CIN), in conjunction with RIN, forms a highpass filter that removes the DC bias from an incoming signal (see Typical Application Circuit). The AC-coupling capacitor allows the amplifier to bias the signal to an optimum DC level. Assuming zero-source impedance, the -3dB point of the highpass filter is given by: f-3dB = 1 2RINCIN
Compensation Capacitor
The stability of the MAX4409 is affected by the value of the feedback resistor (RF). The combination of RF and the input and parasitic trace capacitance introduces an additional pole. Adding a capacitor in parallel with RF compensates for this pole. Under typical conditions with proper layout, the device is stable without the
12
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80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Table 1. Suggested Capacitor Manufacturers
SUPPLIER Taiyo Yuden TDK PHONE 800-348-2496 847-803-6100 FAX 847-925-0899 847-390-4405 WEBSITE www.t-yuden.com www.component.tdk.com
Note: Please indicate you are using the MAX4409 when contacting these component suppliers.
Choose RIN according to the Gain-Setting Resistors section. Choose the CIN such that f-3dB is well below the lowest frequency of interest. Setting f -3dB too high affects the low-frequency response of the amplifier. Use capacitors whose dielectrics have low-voltage coefficients, such as tantalum or aluminum electrolytic. Capacitors with high-voltage coefficients, such as ceramics, may result in increased distortion at low frequencies. Charge-Pump Capacitor Selection Use capacitors with an ESR less than 100m for optimum performance. Low-ESR ceramic capacitors minimize the output resistance of the charge pump. For best performance over the extended temperature range, select capacitors with an X7R dielectric. Table 1 lists suggested manufacturers. Flying Capacitor (C1) The value of the flying capacitor (C1) affects the load regulation and output resistance of the charge pump. A C1 value that is too small degrades the device's ability to provide sufficient current drive, which leads to a loss of output voltage. Increasing the value of C1 improves load regulation and reduces the charge-pump output resistance to an extent. See the Output Power vs. Charge-Pump Capacitance and Load Resistance graph in the Typical Operating Characteristics. Above 2.2F, the on-resistance of the switches and the ESR of C1 and C2 dominate. Output Capacitor (C2) The output capacitor value and ESR directly affect the ripple at PVSS. Increasing the value of C2 reduces output ripple. Likewise, decreasing the ESR of C2 reduces both ripple and output resistance. Lower capacitance values can be used in systems with low maximum output power levels. See the Output Power vs. ChargePump Capacitance and Load Resistance graph in the Typical Operating Characteristics. Power-Supply Bypass Capacitor The power-supply bypass capacitor (C3) lowers the output impedance of the power supply, and reduces the impact of the MAX4409's charge-pump switching transients. Bypass PVDD with C3, the same value as C1, and place it physically close to the PVDD and PGND pins.
Common-Mode Noise Rejection
Figure 6 shows a theoretical connection between two devices, for example, a notebook computer (transmitter, on the left) and an amplifier (receiver, on the right). The application includes the headphone socket used as a line output to a home hi-fi system, for example. In the upper diagram, any difference between the two GND references (represented by VNOISE) causes current to flow through the screen of cable between the two devices. This can cause noise pickup at the receiver due to the potential divider action of the audio screen cable impedance and the GND wiring of the amplifier. Introducing impedance between the jack socket and GND of the notebook helps (as shown in the lower diagram). This has the following effect: * Current flow (from GND potential differences) in the cable screen is reduced, which is a safety issue. * It allows the MAX4409 differential sensing to reduce the GND noise seen by the receiver (amplifier). The other side effect is the differential HP jack sensing corrects the headphone crosstalk (from introducing the resistance on the jack GND return). Only one channel is depicted in Figure 6. Figure 6 has some example numbers for resistance, but the audio designer has control over only one series resistance applied to the headphone jack return. Note that this resistance can be bypassed for ESD purposes at frequencies much higher than audio if required. The upper limit for this added resistance is the amount of output swing the headphone amplifier tolerates when driving low-impedance loads. Any headphone return current appears as a voltage across this resistor.
Layout and Grounding
Proper layout and grounding are essential for optimum performance. Connect PGND and SGND together at a single point on the PC board. Connect all components associated with the charge pump (C2 and C3) to the PGND plane. Connect PVDD and SVDD together at the device. Connect PV SS and SV SS together at the device. Bypassing of both supplies is accomplished by charge-pump capacitors C2 and C3 (see Typical
13
______________________________________________________________________________________
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Application Circuit). Place capacitors C2 and C3 as close to the device as possible. Route PGND and all traces that carry switching transients away from SGND and the traces and components in the audio signal path. Ensure that the COM traces have the same trace length and width as the amplifier input and feedback traces. Route COM traces away from noisy signal paths. The thin QFN package features an exposed paddle that improves thermal efficiency of the package. However, the MAX4409 does not require additional heatsinking. Ensure that the exposed paddle is isolated from GND or VDD. Do not connect the exposed paddle to GND or VDD.
EXAMPLE CONNECTION: VIN = VAUDIO VAUDIO GND NOISE COMPONENT IN OUTPUT = VNOISE/2 0.1 VNOISE 0.1 VREF_IN = VNOISE/2
IMPROVEMENT FROM ADDING MAX4409 WITH SERIES RESISTANCE
* 0.10 RESISTANCE FROM CABLE SCREEN * 0.10 RESISTANCE DUE TO GND CABLING AT RECEIVER * VNOISE REPRESENTS THE POTENTIAL DIFFERENCE BETWEEN THE TWO GNDS
MAX4409
VIN = VAUDIO + (VNOISE x 0.98) VAUDIO GND NOISE COMPONENT IN OUTPUT = VNOISE /100 0.1 RESISTOR IS INSERTED BETWEEN THE JACK SLEEVE AND GND = 9.8 9.8 VNOISE 0.1 VREF_IN = (VNOISE x 0.99)
* 9.8 RESISTOR ADDS TO HP CROSSTALK, BUT DIFFERENTIAL SENSING AT THE JACK SLEEVE CORRECTS FOR THIS (ONE CHANNEL ONLY SHOWN). * CURRENT FLOW (IN SIGNAL CABLE SCREEN) DUE TO VNOISE IS GREATLY REDUCED. * NOISE COMPONENT IN THE RECEIVER OUTPUT IS REDUCED BY 34dB OVER THE PREVIOUS EXAMPLE WITH THE VALUES SHOWN.
Figure 6. Common-Mode Noise Rejection
14
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80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Typical Application Circuit
1.8V to 3.6V LEFT CHANNEL AUDIO IN CIN 1F
RIN 10k
RF 10k
C3 1F 2 PVDD 9 SVDD
12 SHDN
10 INL SVDD
OUTL 8 HEADPHONE JACK 3 C1P UVLO/ SHUTDOWN CONTROL CHARGE PUMP SVSS CLICK-AND-POP SUPPRESSION COM 1 R2 10k R1 10k
C1 1F 5 C1N
SVDD
MAX4409
OUTR 11
PVSS 6 C2 1F
SVSS 7
PGND 4
SGND 14 RIGHT CHANNEL AUDIO IN CIN 1F RIN 10k
INR 13
SVSS
RF 10k
*PIN NUMBERS ARE FOR THE TSSOP PACKAGE.
______________________________________________________________________________________
15
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
System Diagram
VDD 0.1F 15k 0.1F 15k INR VDD PVDD 0.1F AUX_IN OUT 1F 1F BIAS OUTR+ OUTR-
MAX9710
MAX4060
BIAS 2.2k 0.1F IN+ IN0.1F CODEC
0.1F
15k
SHDN INL 15k
OUTLOUTL+ VCC VCC 10k
Q
INVCC 10k
MAX961
Q 10k PVDD SVDD OUTL IN+
100k 100k 0.1F VCC
1F 1F
SHDN 10k INL 10k INR PVSS SVSS 1F C1P
1F
MAX4409 OUTR
COM 10k 10k CIN
1F
10k
16
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80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
Pin Configurations
TOP VIEW
PVDD COM SGND N.C. N.C.
MAX4409
19
20
18
17
16
COM 1
14 SGND 13 INR 12 SHDN
C1P PGND CIN N.C. PVSS
1 2 3 4 5 10 7 6 8 9
15 14
INR SHDN INL N.C. OUTR
PVDD C1P
2 3
MAX4409
13 12 11
PGND 4 C1N 5 PVSS 6 SVSS 7
MAX4409
11 OUTR 10 INL 9 8 SVDD OUTL
N.C.
OUTL
SVDD
SVSS
N.C.
TSSOP
THIN QFN
Chip Information
TRANSISTOR COUNT: 4295 PROCESS: BiCMOS
______________________________________________________________________________________
17
80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense MAX4409
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.
QFN THIN.EPS
L
REV.
0.15 C A
D2
C L
D
b D2/2
0.10 M C A B
PIN # 1 I.D.
D/2
0.15 C B
k
PIN # 1 I.D. 0.35x45
E/2 E2/2 E (NE-1) X e
C L
E2
k L
DETAIL A
e (ND-1) X e
C L
C L
L
e 0.10 C A 0.08 C
e
C
A1 A3
PROPRIETARY INFORMATION TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
APPROVAL DOCUMENT CONTROL NO.
21-0140
C
1 2
COMMON DIMENSIONS
EXPOSED PAD VARIATIONS
NOTES: 1. DIMENSIONING & TOLERANCING CONFORM TO ASME Y14.5M-1994. 2. ALL DIMENSIONS ARE IN MILLIMETERS. ANGLES ARE IN DEGREES. 3. N IS THE TOTAL NUMBER OF TERMINALS. 4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JESD 95-1 SPP-012. DETAILS OF TERMINAL #1 IDENTIFIER ARE OPTIONAL, BUT MUST BE LOCATED WITHIN THE ZONE INDICATED. THE TERMINAL #1 IDENTIFIER MAY BE EITHER A MOLD OR MARKED FEATURE. 5. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.25 mm AND 0.30 mm FROM TERMINAL TIP. 6. ND AND NE REFER TO THE NUMBER OF TERMINALS ON EACH D AND E SIDE RESPECTIVELY. 7. DEPOPULATION IS POSSIBLE IN A SYMMETRICAL FASHION. 8. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS. 9. DRAWING CONFORMS TO JEDEC MO220. 10. WARPAGE SHALL NOT EXCEED 0.10 mm.
PROPRIETARY INFORMATION TITLE:
PACKAGE OUTLINE 16, 20, 28, 32L, QFN THIN, 5x5x0.8 mm
APPROVAL DOCUMENT CONTROL NO. REV.
21-0140
C
2 2
18
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80mW, DirectDrive, Stereo Headphone Amplifier with Common-Mode Sense
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information, go to www.maxim-ic.com/packages.
TSSOP4.40mm.EPS
MAX4409
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 19 (c) 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.


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